Recycling and refining gold, silver and copper from waste circuit boards, dismantling and processing them into gold

Components are usually soldered to the circuit board with solder or a tin-lead alloy. Practice has proved that when the solder joints are heated to 180-220 degrees, the solder joints will melt, and the components will be separated from the circuit board by roller rolling friction. HC automatic tin removal machine mainly adopts the combination of external air duct heater and infrared auxiliary heater for thermal removal of tin; Heating is constant temperature and stable heating. With multiple internal temperature controllers, the temperature can be effectively and accurately controlled between 180 degrees and 230 degrees. Make sure the tin is softened. As the channel passes through the rollers, the rolling friction of the material in the cavity dislodges the part.

The equipment and process for physically treating and recycling waste printed circuit boards mainly include crushing and disintegration of waste printed circuit boards. Dry and wet separation techniques are used to separate metals and non-metals. The study found that when the crushing degree reaches 1.2mm, the waste motherboard can basically dissociate, the copper content in the crushed product is about 6%, the other metal content is about 18%, and the non-metal content is about 76%; copper is mainly distributed in <0.5%. In the powder of mm, the metal is mainly distributed in the particle size > 0.5mm; the high-frequency airflow separator can effectively separate non-metals and metals, with a wide separation particle size range, low separation lower limit, and low operating cost. It is an ideal dry separation. equipment.